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  • Paitek Packaging Continues to Deepen R&D Efforts, Enhancing Competitiveness Across Full Packaging Portfolio

    Paitek Packaging Continues to Deepen R&D Efforts, Enhancing Competitiveness Across Full Packaging Portfolio Leveraging its three manufacturing bases in Kunshan, the Philippines, and Guangdong, as well as ISO9001 and ISO14001 management systems, Paitek Packaging has recently obtained multiple utility model patents in areas including blister tray clamping and limiting devices, plastic box stamping devices, tray stacking devices, and arbitrarily stackable blister tray structures. These patents form an integrated technology chain covering mold design, product forming, and post-process stacking. The patented plastic box stamping device effectively addresses the issue of tool change without production interruption, significantly improving flexibility for small-batch, high-variety orders. With balanced development across blister packaging, plastic bags, and die-cutting products, Paitek Packaging is accelerating its transformation into a one-stop integrated packaging solution provider. Guided by the principle — “Customer satisfaction is our standard” — the company is committed to creating long-term, stable packaging value for global customers through continuous technological iteration and quality optimization.

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  • Paitek Packaging Granted Patent for Clamping and Limiting Device, Solving Thin Sheet Processing Challenges

    Kunshan Paitek Packaging Products Co., Ltd. has recently been granted a utility model patent (Publication No. CN223948495U) by the China National Intellectual Property Administration for a clamping and limiting device used in blister tray processing. According to the patent description, the technology evenly distributes clamping force across multiple points of the plastic sheet, reducing local overpressure that may occur at a single clamping point. This effectively prevents the risk of cracking and deformation. This technology is of great significance for the production of high-demand products such as precision electronic components and medical supplies. To date, Paitek Packaging has accumulated 23 patents, demonstrating continuous technological progress in blister packaging processes. As a qualified supplier to industry leaders such as Jabil, ASUS, Seagate, and Lite-On, the company continues to improve product quality and delivery stability through innovation, providing customers with high-performance packaging solutions.

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